Ufs Bga 254 Datasheet Link

The package is a multi-chip package (MCP) footprint widely used in modern mobile devices to combine UFS (Universal Flash Storage) and LPDDR (Low Power DDR) RAM into a single physical chip .

: Capable of interfacing with both UFS 2.1/3.x and eMMC 5.1 storage standards. Ufs Bga 254 Datasheet